Planar Sputtering target
The planar sputtering target is connected to the sputtering device by means of a smattering method, and the film is deposited on the substrate under vacuum conditions, and then passed through the substrate. Various means (etching) are applied to the film to meet different needs.
Our company produces Flat planar Sputtering targets for various models and applications, including tool coatings, decorative coatings, functional coatings, multi-Arc sputtering and more. According to different customer requirements, we can provide drawings and usage suggestions, and tailor the appropriate targets for customers.
Planar target size range:
Rectangular Shape: (30~4000)*(20~4000)*(4~25)mm
Round Shape: Diameter 500mm*50mm thick
Purity range: 99.5%~99.9%, 99.95%, 99.99%, 99.999%, 99.9999%
Technology accumulation
A variety of production techniques and equipment (cold isostatic pressing + various atmosphere sintering technology, spraying technology, low temperature metal / alloy centrifugal casting technology, vacuum hot pressing sintering technology, hot isostatic sintering technology, electron beam melting / regional melting Purification technology, etc.)
Product diversity
Customized service of the product
Waste target recycling and reuse technology
Self-owned intellectual property target bonding
Thin film layer design and material application design
Powder material synthesis technology
Ultrafine powder dispersion and dispersion technology
DCC and CIP material forming technology
Various types of atmosphere protection and sintering technology
Metal and ceramic friction welding technology
Centrifugal casting and precision metal alloy processing
Plasma spray material manufacturing and surface treatment technology
