化学气相沉积技术是把含有构成薄膜元素的单质气体或化合物供给基体，借助气相作用或基体表面上的化学反应，在基体上制出金属或化合物薄膜的方法，主要包括常压化学气相沉积、低压化学气相沉积和兼有CVD和PVD两者特点的等离子化学气相沉积等。

Chemical vapor deposition technology is the elemental gas containing a membrane element or compound supply base, with the aid of the gas phase or substrate on the surface of a chemical reaction, on the matrix method of making metal or compound film, mainly including atmospheric pressure chemical vapor deposition, low pressure chemical vapor deposition and has both features of CVD and PVD plasma chemical vapor deposition, etc.