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物理气相沉积(PVD)

通过各种物理方法,将电镀材料汽化成原子和分子或电离成离子,直接沉积在基材表面。大多数硬质反应膜是用物理气相沉积法制备的。它利用材料的热蒸发或离子轰击表面原子溅射等物理过程,实现材料原子从源材料到薄膜的可控转移过程。物理气相沉积(PVD)技术具有膜/基材结合力好、膜均匀致密、膜厚控制好、靶材宽、溅射范围宽、膜沉积厚、合金膜稳定、重复性好等优点。

By various physical methods, the plating material is vaporized into atoms and molecules or ionized into ions, which are directly deposited on the substrate surface. Most of the hard reactive films are prepared by physical vapor deposition. It uses some physical processes, such as the thermal evaporation of materials, or the sputtering of surface atoms when bombarded by ions, to realize the controllable transfer process of material atoms from source materials to thin films. Physical vapor deposition (PVD) technology has the advantages of good film / substrate bonding force, uniform and compact film, good film thickness control, wide target materials, wide sputtering range, thick film deposition, stable alloy film and good repeatability.

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