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溅射镀膜(SC)

溅射镀膜就是在真空中利用荷能粒子轰击靶表面,使被轰击出的粒子沉积在基片上的技术。通常,利用低压惰性气体辉光放电来产生入射离子。阴极靶由镀膜材料制成,基片作为阳极,真空室中通入0.1-10Pa的氩气或其它惰性气体,在阴极(靶)1-3KV直流负高压或13.56MHz的射频电压作用下产生辉光放电。电离出的氩离子轰击靶表面,使得靶原子溅出并沉积在基片上,形成薄膜。溅射方法很多,主要有二级溅射、三级或四级溅射、磁控溅射、对靶溅射、射频溅射、偏压溅射、非对称交流射频溅射、离子束溅射以及反应溅射等。


Sputtering coating is a technology that bombards the target surface with charged particles in a vacuum to deposit the particles on the substrate. In general, incident ions are generated by a low pressure inert gas glow discharge. The cathode target is made of coated material, the substrate is used as the anode, and argon or other inert gas is pumped into the vacuum chamber, which generates glow discharge under the action of 1-3kV dc negative high voltage or 13.56mhz RF voltage of the cathode (target). Ionized argon ions bombard the target surface, causing target atoms to splash out and deposit on the substrate, forming a thin film. There are many sputtering methods, including secondary sputtering, tertiary or quaternary sputtering, magnetron sputtering, target sputtering, rf sputtering, bias sputtering, asymmetric RF sputtering, ion beam sputtering and reactive sputtering.


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